Thank you for your interest in NSN part number ROM PROM FAMILY 058 under NSN 5962002347278 on Click Aerospace. Click Aerospace is a website owned and operated by ASAP Semiconductor, offering customers access to an unparalleled inventory of premium parts that cater to a variety of industries and applications. Microcircuit Memory is an item listed with the part number ROM PROM FAMILY 058, and FSC 5962 Microcircuits Electronic and it is manufactured by Dla Land And Maritime having CAGE Code 16236. This item, alongside the rest of our listed NSN parts, is readily available for purchase through our website now. Get started on the purchasing process today by filling out and submitting an Instant RFQ as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to offer a personalized quote based on your individual needs.
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Click Aerospace is a leading independent distributor of NSN part ROM PROM FAMILY 058, and we can help you procure NSN components such as 5962002347278 and many more. The quality of our inventory is of the utmost importance to us, and thus we choose to only source our parts from global manufacturers like Dla Land And Maritime. Get started with a competitive quote today when you submit an Instant RFQ and experience how we are revolutionizing the parts procurement process.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-234-7278 Item Description: Microcircuit Memory | 5962 | 002347278 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Rom Prom Family 058 | C | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.260 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.150 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.045 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMED AND HERMETICALLY SEALED AND BURN IN |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | GOLD |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | DIODE MATRIX |
PMLC | III PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
PRMT | III PRECIOUS MATERIAL | GOLD |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
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